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D-Sub高黏度進行防水連接器AMPHENOL

上線準確時間：2023-09-06 16:40:00     查看：961

AMPHENOL的D-Subminiature高密度產品系列為線路板和電纜線末端提供各種線接選擇，明顯減少了電纜組件和連接器整體成本。接線端子包含板側的直立式、直角、SMT、電纜接頭和超薄型沉頭接線端子，及其電纜線側的焊杯、電纜接頭、IDC帶條狀、無焊繞線和螺母接線端子。各個線接規格都有插座和插頭連接器。

D-Sub高容重聯接器夾角PCB線接有二者封口空間布局式樣：非洲規模和軍工概念股用空間布局。搭配方法方法教育板塊遇到從表面時常為橘黃顏色，能基于需求要的充裕搭配方法方法工作頻率抉擇兩類大致板厚：閃光彈金、15μ"和30μ"。打交道點可能打造細密機械制造制作加工的航天軍工用級最新版本（特殊電流量高至7.5A）以保障機制很安全可靠的性，也可夠提供了更成本且可民用的額定值瞬時電流為3A的沖壓加工手機版本。

D-Sub高高密集度聯接器規范標準系列產品常從A到E的5種基本上機身規格尺寸，AMPHENOL的混后鏈接器在資料衛星信號、電源開關和同軸電線多方面有著獨角獸高達18個碰到點對齊。堆疊（雙端口號）D-Sub高密集度計算公式連接方式器商品系列表相當的高。AMPHENOL新建發的可作PIP悍接細長（或沉式或短型）系列的在AMPHENOL的工商業加盟商中獲取成功創業。除此本身，AMPHENOL還需要為任何APP提供數據機 ，分為不銹鋼蓋、朔膠防火蓋、保護措施罩、主裝機 、寶寶血型互轉和所有更換器。

表現形式

標準單位D形聯接器

EMI復合塑料外殼

插孔保護接地裝備凹坑

放進件由阻燃性熱延性塑生產制作而成

APP餐飲業印章打交道點

有全方向位置線接超范圍的變體

各樣線接尺寸均保證電源插座和插座

優點

確保安全生產準確的協調位置

重點廣泛用于成批生產方式但降底成本費用的處理好預案

UL#E232356認可

兼容各種類型朋友供需

達到的技術標準化

特殊的類別適于于管腳焊錫膏或逆流氬弧焊

上海市立維創展網絡加盟代理商AMPHENOL亚洲一区二区精品-欧美一区二区三区在线-午夜精品在线-亚洲综合一区二区各級領域行業產品的類型，在AMPHENOL，AMPHENOL信在開拓業務部業務部的過程中中修出可不間斷的選定就可以為股東人員增減創造自己而短時間內和太久總價值。AMPHENOL的每問題項業務員都秉承于持續改進建議其設置，采購計劃，打造和交由服務的的方法，認真提供或撼動用戶對整塊實用供應鏈一體化中服務服務管理的盼望。AMPHENOL 的服務將安全防護和生態保護性看做第一步神器任務，并選擇ISO 14001和OHSAS 18001等認為規定服務管理這部分方案。僅是，注冊和中國法律合法性性還不足夠。AMPHENOL既僅嚴守法律規范就能開創長期性的意義。

祥情理解AMPHENOL可點擊：//yhme.cn/article/1321.html

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PART NUMBER

DESCRIPTION

G17DC15023313HR

Dsub Slim Right Angle Dip, High Density 15 Position Receptacle VGA, Sunk 4.27mm, 15μin Au, Footprint 1.6mm, 2 Rows, Pitch 1.0mm, Post distance 1.4mm, PCB hole distance 2.3mm, Tail 3.05mm, Tape and Reel with Cap, Blue 661C, PIP, Halogon Free

G17DD1504232GHR

G17DD1504232GHR-Slim Right Angle Dip HD 15P Receptacle

G17DD1504232RHR

G17DD1504232RHR-Slim Right Angle Dip HD 15PReceptacle

G17DD1504232SHR

G17DD1504232SHR-Slim Right Angle Dip HD 15P Receptacle

L177HDA26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH3R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock

L177HDAG26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock

L177HDAG26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAG26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock

L177HDAH26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Insert, 4-40 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SVF

Dsub, Stamped Signal 3A, Straight Soldercup, 26 Socket, Bright Tin Shell, 0.38m (15 in) Gold, 4-40 Removable Front Screwlock, 4-40 Threaded Nut

L177HDB44S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDB44SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock


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