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?722-0005-01-E01射頻和微波評估板

關鍵性性能

722-0005-01-E01射頻和微波評估板

面積：0.75 x 0.050 單片機集成塊/單片機集成塊高耐熱性 DC-12.4 GHz低放入耗損（0.7 dB @ 12.4 GHz）低駐波比 (1.20:1)3x RF 接口 / 2x DC 接口可引線鍵合和可焊接加工順利通過層面高效去內嵌例如 3x 性能較高指標 SMA備貨周期公式：6-8周

品牌：Electro-Photonics

成品詳情頁價紹

RF/Microwave Evaluation Board

This high performance RF/MW evaluation board is for a 3-port device up to .075 x .050 size. Each board comes with three high performance end launch connectors that are easy to assemble. In addition, this board is solderable and wire bondable. A DC feed line is provided for biasing and a thru is also provided for quick de-embedding.

Highlights

Measure: 0.75 x .050 Die/Chip
High Performance DC-12.4 GHz
Low Insertion Loss (0.7 dB @ 12.4 GHz)
Low VSWR (1.20:1)
3x RF Ports / 2x DC Ports
Wire Bondable and Solderable
Thru Line for Quick De-embedding
Includes 3x High Performance SMA

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